2025/05/21
Taipei, May 21, 2025 — H3 Platform today announced its latest collaboration with AIC Inc. to showcase high-density AI storage and CXL memory sharing solutions at COMPUTEX 2025. These joint innovations are designed to address the growing demands of AI training, inference, and data-intensive workloads by delivering scalable performance and efficient resource utilization for modern data center environments.
The high-density AI storage platform, developed through this collaboration, features PCIe Gen6 connectivity, supports up to 64 E1.S NVMe SSDs, and accommodates up to 10 GPUs/DPUs/NICs. By leveraging GPU acceleration, the system boosts NVMe SSD IOPS performance by up to 10×—from 20 million to 200 million IOPS—delivering a powerful throughput pump for data-intensive applications. This architecture provides the bandwidth and flexibility required for generative AI, large-scale model training, and high-throughput analytics, enabling data centers to overcome performance bottlenecks and accelerate AI inferencing and other compute-heavy workloads.
Complementing the storage platform, the CXL (Compute Express Link) memory sharing solution enables up to 5TB of shared memory across five servers. The solution allows flexible memory allocation without the need for software modifications, maintaining stable throughput and low latency even under heavy workload conditions. Benchmark testing has demonstrated a 1.7× improvement in total throughput and consistent performance across multi-tenant environments, effectively addressing the scalability challenges of traditional DRAM architectures.
Brian Pan, CEO of H3 Platform, stated: "H3 Platform’s mission is to build infrastructure that scales with the real needs of today’s data-intensive workloads. Our CXL Memory Sharing Solution offers consistent, high-performance scalability in hyperscale environments without requiring application changes. Combined with our high-density AI storage platform, we enable generative AI, large model training, and inference workloads to run smoothly with high bandwidth and low latency."
"AIC is proud to collaborate with H3 Platform to deliver next-generation storage and memory solutions. Our continuous investment in scalable, high-performance infrastructure underscores our shared commitment to supporting AI and HPC innovation, empowering customers to succeed in a data-driven world." said Michael Liang, CEO and President of AIC Inc.
H3 Platform and AIC will demonstrate these solutions at Booth M1119a, 4F, TaiNEX 1 (Taipei Nangang Exhibition Center) during COMPUTEX 2025, taking place from May 20 to 23, 2025.
H3 Platform is a technology leader in composable infrastructure solutions based on PCIe and CXL. By developing scalable, memory-centric architectures, H3 enables enterprises to efficiently power AI, HPC, and cloud workloads across modern data centers. The company’s CXL-based memory sharing technologies simplify resource orchestration, reduce total cost of ownership, and deliver consistent performance for next-generation applications.
Learn more at www.h3platform.com