October 13, 2025
H3 Platform showcases CXL 1.1/2.0 Memory Sharing & Pooling with partners at OCP 2025, advancing AI.
READ MOREJuly 09, 2025
H3 Platform launches its CXL 1.1/2.0 Memory Sharing and Pooling Platform with three deployment modes and intuitive CLI/GUI, enabling enterprises to scale memory, boost performance, and reduce costs — now ready for all customers.
READ MOREMay 21, 2025
H3 Platform and AIC showcase high-density AI storage and CXL memory sharing at COMPUTEX 2025, enabling scalable, low-latency solutions for AI training, inference, and data-intensive workloads in modern data centers.
READ MOREMay 20, 2025
H3 Platform’s CXL Memory Sharing Solution with Micron CZ122 and famfs enables low-latency, high-efficiency memory sharing across servers, boosting AI and database performance—without any software changes.
READ MOREMay 20, 2025
At COMPUTEX 2025, H3 Platform and SMART Modular showcased a second-gen CXL Memory Sharing solution, enabling four hosts to access 16 modules and a 5TB shared pool—demonstrating system stability, scalability, and readiness for AI and cloud deployments.
READ MOREOctober 21, 2024
H3 Platform showcases its cutting-edge CXL Memory Sharing solution at OCP 2024, highlighting enhanced performance, scalability, and cost efficiency for data centers. The demonstration features Micron's CZ120 memory modules and the groundbreaking Virtual CXL Switch (VCS) mode, improving memory management for AI and large-scale workloads. This innovative solution underscores H3 Platform's leadership in advancing CXL technology.
READ MOREOctober 17, 2024
H3 Platform, Xconn, and AIC are advancing CXL 2.0 technology by jointly developing Virtual CXL Switch (VCS) mode. This collaboration with Intel leverages AIC’s Sierra Forest server and Xconn’s CXL 2.0 switch, aiming to improve memory management, performance, and dynamic memory sharing for data centers, enhancing high-performance computing capabilities.
READ MOREOctober 17, 2024
H3 Platform and Samsung will jointly showcase the CXL 2.0 VCS Memory Sharing Solution at the OCP Global Summit. Samsung will present its advanced CXL Memory Module, while H3 Platform will demonstrate its Virtual CXL Switch (VCS) mode, a groundbreaking technology for efficient memory management in data centers.
READ MOREAugust 12, 2024
H3 Platform announces the End of Life (EoL) for Falcon 4005, 4010, 4109, 4118, and 5208 products, effective August 12, 2024. These products will no longer be available or supported. Alternatives include Falcon 4210, 4205, and the latest PCIe Gen5 Falcon 5012 for enhanced performance.
READ MOREJune 03, 2024
H3 Platform, a leading software developer in Composable Infrastructure, announced its collaboration with AIC Inc. at COMPUTEX 2024 to showcase two innovative solutions: the CXL Memory Sharing Solution and the PCIe Gen5 GPU Solution. This partnership combines H3's software expertise with AIC's hardware technology, aiming to enhance system performance and resource utilization. Visit their booth at Nangang Exhibition Center, Hall 1, Fourth Floor, Area N, booth N0806.
READ MOREFebruary 27, 2024
H3 Platform unveils the Falcon 5012, a PCIe Gen5 GPU solution EVT sample, representing a significant advancement in technology. With 8-10 GPU expansions in one 4U chassis, the Falcon 5012 addresses the growing demand for GPUs, particularly in AI applications. CEO Brian Pan expresses excitement about this milestone in innovation. To celebrate the release, H3 Platform offers an exclusive unboxing video showcasing their commitment to innovation. Interested parties are invited to participate in virtual demonstrations and webinars to explore the technology further. Stay updated on the Falcon 5012 and upcoming events by visiting www.h3platform.com or following H3 Platform on social media.
READ MOREOctober 03, 2023
H3 Platform will have a presentation at OCP Summit 23, where we'll be discussing the latest developments in CXL Memory Pooling. Join us as we dive into '256-lane CXL Switch and Testing Results.' It's time to register for it!
READ MOREAugust 08, 2023
Joint demonstration eliminates Out-of-Memory errors to accelerate AI/ML workloads
READ MOREJuly 04, 2023
H3 achieves remarkable milestones in composable infrastructure with integrated memory pooling through the revolutionary Xconn switch, redefining technological boundaries. As pioneers in the industry, H3 overcomes obstacles, solidifying their position. Stay tuned for more exciting updates as they continue to push boundaries and explore new horizons. #techprogress #Innovation
READ MOREMay 05, 2023
PCIe Gen 5 NVMe MR-IOV solution, an incredible breakthrough that will revolutionize the industry! Register now to learn from the best!
READ MOREMay 05, 2023
H3 Platform, a leading provider of composable infrastructure solutions, will host a webinar on June 6 and 7 to introduce its latest product, the PCIe Gen 5 NVMe MR-IOV solution. The solution allows for high-speed storage resources to be shared seamlessly across a network, reducing hardware costs and simplifying storage resource management. Attendees will have the opportunity to learn about this technology and participate in a Q&A session with H3's experts. The webinar is open to anyone interested in the latest advancements in storage technology and can be registered for on H3 Platform's website.
READ MOREJanuary 12, 2023
H3 builds up the future of the composable infrastructure in partnership with Broadcom.
READ MOREDecember 12, 2022
The H3 team is bringing up the world's first PCIe 5.0 ToR fabric box for the GPU composable solution!
READ MOREOctober 06, 2022
H3 proudly presents the world's 1 st memory sharing/mapping solution.
READ MOREOctober 08, 2021
Falcon 5208 Multi-host NVMe SR-IOV solution launch announcement.
READ MOREH3 Platform showcases CXL 1.1/2.0 Memory Sharing & Pooling with partners at OCP 2025, advancing AI.
H3 Platform launches its CXL 1.1/2.0 Memory Sharing and Pooling Platform with three deployment modes and intuitive CLI/GUI, enabling enterprises to scale memory, boost performance, and reduce costs — now ready for all customers.
H3 Platform and AIC showcase high-density AI storage and CXL memory sharing at COMPUTEX 2025, enabling scalable, low-latency solutions for AI training, inference, and data-intensive workloads in modern data centers.
H3 Platform’s CXL Memory Sharing Solution with Micron CZ122 and famfs enables low-latency, high-efficiency memory sharing across servers, boosting AI and database performance—without any software changes.
At COMPUTEX 2025, H3 Platform and SMART Modular showcased a second-gen CXL Memory Sharing solution, enabling four hosts to access 16 modules and a 5TB shared pool—demonstrating system stability, scalability, and readiness for AI and cloud deployments.
H3 Platform showcases its cutting-edge CXL Memory Sharing solution at OCP 2024, highlighting enhanced performance, scalability, and cost efficiency for data centers. The demonstration features Micron's CZ120 memory modules and the groundbreaking Virtual CXL Switch (VCS) mode, improving memory management for AI and large-scale workloads. This innovative solution underscores H3 Platform's leadership in advancing CXL technology.
H3 Platform, Xconn, and AIC are advancing CXL 2.0 technology by jointly developing Virtual CXL Switch (VCS) mode. This collaboration with Intel leverages AIC’s Sierra Forest server and Xconn’s CXL 2.0 switch, aiming to improve memory management, performance, and dynamic memory sharing for data centers, enhancing high-performance computing capabilities.
H3 Platform and Samsung will jointly showcase the CXL 2.0 VCS Memory Sharing Solution at the OCP Global Summit. Samsung will present its advanced CXL Memory Module, while H3 Platform will demonstrate its Virtual CXL Switch (VCS) mode, a groundbreaking technology for efficient memory management in data centers.
