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press release

H3 Platform to Showcase Next-Generation CXL Memory Sharing & Pooling Solutions at OCP Global Summit 2025, Featuring Expanded Partner Ecosystem and Live Demonstrations

2025/10/13

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San Jose, USA – October 13, 2025 H3 Platform, a leading company in CXL-based memory disaggregation and composable infrastructure, will demonstrate its latest CXL Memory Sharing and Pooling solutions at OCP Global Summit 2025 (OCP ’25). This year’s showcase highlights significant performance improvements, expanded ecosystem partnerships, and integration with industry-leading memory modules, switch technologies, and server platforms.

Technical Highlights and Innovations

Expanded Ecosystem Collaborations

This year, H3 Platform continues to collaborate with industry leaders including Samsung, Micron, Xconn, and AIC to deliver fully validated end-to-end solutions. The showcase highlights how ecosystem synergy accelerates API adoption for AI, cloud, and HPC data centers.

“Our ongoing dialogue with H3 Platform reflects our shared belief in the importance of ecosystem collaboration in accelerating CXL memory adoption, as we jointly envision the future of composable memory for AI and data center workloads,” said Jangseok Choi, Vice President at Samsung Electronics. “At OCP 2025, Samsung will demonstrate memory pooling with virtualization using Composable Memory System orchestration tools, showcasing our commitment to the broader CXL ecosystem.” 

“Samsung’s ongoing engagement demonstrates the value of open collaboration in building the foundation for next-generation memory technologies,” said Brian Pan, CEO of H3 Platform. “With our Virtual CXL Switch (VCS) mode, H3 Platform continues to advance the management and scalability of composable memory infrastructure. Together with industry partners like Samsung, we are enabling a more flexible, efficient, and software-defined ecosystem that supports the rapidly evolving needs of AI and data center workloads.”

Together with its ecosystem partners, H3 Platform continues to shape the future of composable memory, driving innovation that bridges CXL technology and AI infrastructure for scalable, next-generation data centers.

Live Showcase at OCP ’25

About H3 Platform

H3 Platform, founded in 2016 and headquartered in New Taipei, Taiwan is a pioneer in PCIe/CXL switching and composable infrastructure solutions. The company’s mission is to help data centers achieve greater efficiency, scalability, and flexibility through innovative memory resource sharing and management technologies.

Media Contact
For more information, please contact:
H3 Platform Media Relations
Email: william.tenn@h3platform.com | Tel: +886-2-2698-3800 #121