2024/10/21
SAN JOSE, Calif., October 21, 2024 – H3 Platform is proud to showcase its cutting-edge CXL Memory Sharing solution at OCP 2024, demonstrating a significant breakthrough in memory technology that addresses the growing need for scalable and efficient memory sharing in data centers.
At OCP 2024, H3 Platform will demonstrate how Micron’s CZ120 memory modules integrate with its advanced composable CXL memory management software. This demonstration will highlight the enhanced performance, scalability, and total cost of ownership (TCO) benefits delivered by CXL Memory Sharing, particularly for large databases, machine learning, and AI workloads.
In addition, H3 Platform will unveil its groundbreaking Virtual CXL Switch (VCS) mode, a technology poised to revolutionize data center architecture. VCS mode enables servers to access downstream memory, significantly improving memory management and providing more precise event notifications. This technology empowers data centers to manage memory resources more effectively, dynamically adjusting to various application scenarios, enabling the CXL host to better control downstream devices.
H3 Platform contributed to showcasing Micron’s Fabric Attached Memory File System (FAMFS) on CXL, which allows seamless memory sharing and pooling across nodes, significantly improving the performance of RocksDB and other data-intensive applications. This solution, developed by Micron, provides modular scalability, supporting up to 5.5TB per x16 PCIe lane, while avoiding the performance bottlenecks typically seen in traditional DRAM + SSD setups. Results show a tenfold increase in memory capacity and significant improvements in P99 latency during database access.
"The integration of Micron’s CXL 2.0 memory modules, including the CZ120 and CZ122, with H3 Platform’s CXL memory management software provides a powerful solution for memory pooling and sharing. This addresses the growing demands of today’s data centers, particularly in AI and machine learning workloads," said Vijay Nain, Senior Director of CXL Product Management at Micron. “We’re excited to see how Famfs provides memory sharing capabilities from one memory pool to multiple nodes, helping improve both performance and TCO.”
"We are excited to showcase our innovative advancements in CXL memory technology at OCP 2024," said Brian Pan, CEO of H3 Platform. "This demonstration highlights our commitment to developing solutions that address the critical need for efficient memory management in data centers, and we look forward to showing the industry the powerful potential of CXL Memory Sharing Solution."
This demonstration underscores H3 Platform's leadership in advancing CXL technology and showcases how the company continues to innovate in response to the evolving demands of modern data centers. Looking ahead, H3 Platform remains committed to exploring the technological frontiers and driving further advancements in memory technology.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more about Micron Technology, Inc. (Nasdaq: MU), visit micron.com.
Founded in 2016, H3 Platform is a leading software developer specializing in data center solutions. We are committed to designing innovative and composable architectures to optimize IT efficiency, scalability, and flexibility. The company is a leader in PCIe/CXL switching system management software technology, possessing cutting-edge knowledge and technology, and boasting an extensive user base worldwide.
Zhuyun Deng
Email: zhuyun.deng@h3platform.com
Company Website: H3 Platform Website